Significant challenges arise with shrinking feature sizes such as etching with thin masks: Revision history

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10 May 2024

  • curprev 05:0605:06, 10 May 2024‎ Copyplane5 talk contribs‎ 5,594 bytes +5,594‎ Created page with "Traditionally this has been addressed with hard masks and consequently additional costly steps. Here we present a pathway to high selectivity soft mask pattern transfer using cryogenic plasma etching towards low-cost high throughput sub-10 nm nanofabrication. selectivity inductively coupled plasma etching of silicon. Selectivity was maximized on large features (400 nm-1 μm) with a focus on minimizing photoresist etch rates. An overall anisotropic profile with selectivit..."
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